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October 15 - 18, 2019
Sheraton Boston, MA
BEN VANDERPLAS, Global Product Manager at Sonoco Thermosafe
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BEN VANDERPLAS


Global Product Manager
Sonoco Thermosafe

Master Class Day: Wednesday, October 16, 2019

Wednesday, October 16th, 2019


8:45 AM Sonoco Thermosafe Master Class: Certification Program- Life-Cycle Development of Temperature Assurance Packaging (TAP)

The certification program is a one-day, interactive training course designed to guide participants through the process of developing Temperature Assurance Packaging (TAP) solutions from beginning to end. Topics to be explored include: regulations, transportation/logistics, ambient profiles, operations, and package design. The course is conducted by a diverse team of industry experts who will provide handson instruction with a case-study based learning environment.

Certified Professionals will be able to:
  • Understand the fundamentals of temperature assurance packaging
  • Evaluate different solutions to determine what best meets the needs of their company
  • Guide the implementation of temperature assurance packaging solutions within your organization
  • Grasp the key processes, protocols and techniques involved in designing temperature-controlled packaging

As a precursor to the Professional Course, you will be provided access to the online “Fundamentals” course. This self-paced course is designed to ensure participants develop a solid foundation and understanding of the key elements associated with temperature assurance packaging. At the conference, participants will build upon the knowledge they gained during the “Fundamentals” course as a progression into the “Professional” course. All participants completing courses will be awarded with a Certificate of Completion.

Main Conference Day Two: Friday, October 18, 2019


11:45 AM Industry Collaboration to Enhance Sustainable Packaging Solutions: Updates on the Return & Reuse Best Practice Guidance

This session will provide a critical update on how both pharma companies and the packaging industry have collaborated to drive standardization of re-usable packaging solutions, allowing the use of more robust shippers at a reasonable price and reducing waste and negative environmental impact.

  • Update on packaging and standardizing Operational Qualification (OQ)
  • New developments in the re-use of materials
  • Overview of the technical paper’s content soon to be published by USP including: passive thermal packaging system types, reuse qualification, refurbishment service and inspection details
  • Upcoming group projects including new topics and membership

Check out the incredible speaker line-up to see who will be joining Ben.

Download The Latest Agenda