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Trends, Challenges, & Case Studies for Shipping Temperature Sensitive Products

This FREE webinar was recorded on:
Monday, October 29, 2012
09:00 AM - 10:00 AM EDT
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Trends, Challenges, & Case Studies for Shipping Temperature Sensitive Products

The pharmaceutical and biotechnology industries are continuously confronted with new and evolving regulations when shipping temperature sensitive products.

New regulations challenge existing logistics methodologies and often times require procedural revisions and/or the implementation of new packaging and monitoring technologies in order to remain compliant. This webinar will provide an overview of industry trends, the challenges they have created, and methods for cost effective compliance. Case studies will highlight solutions to the challenges and provide guidance to companies faced with these issues.

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Ben VanderPlas
Global Product Manager
ISC Labs, Sonoco ThermoSafe

Ben VanderPlas is the Global Product Manager for ISC Labs, ThermoSafe Brands’ flagship design and testing services.  Ben has worked for ThermoSafe Brands for seven years and has had multiple roles in engineering, sales, and marketing.  Ben has participated in the development of hundreds of temperature assurance solutions while working with many of the world’s top pharmaceutical and biotechnology companies.  He is a member of the Institute of Packaging Professionals and has earned a Certified Packaging Professional designation.  Ben graduated from Michigan State University with a Bachelor of Science from the School of Packaging.  He is currently attending Northwestern University pursuing a Master of Engineering Management degree.

Iftekhar Ahmed
Engineering Design Team Lead
Sonoco ThermoSafe

Iftekhar Ahmed is the Design Team Lead and Senior Design Engineer for Sonoco ThermoSafe. His responsibilities include managing the engineering thermal design team and all 3D modeling systems and support. Iftekhar has been with ThermoSafe since January of 2011.

Iftekhar has more than 20 years experience in CAE software development and applications with an emphasis on heat transfer and fluid mechanics. He has worked on several projects implementing thermal simulation solutions for a wide range of products. Most recently he was with MAYA Heat Transfer Technology as a Senior Engineering Specialist.

Iftekhar holds a Master’s of Science in Mechanical Engineering from the University of Michigan in Ann Arbor, Michigan.